内容简介：
Multichip modules (MCMs) with high wiring density, controlled impedance interconnects and thermal management capability are a recent evolution in electronics, addressing the problems associated with manufacturing high-speed, complex devices. The integration of sensors with high-performance MCM structures represents the trend in intelligent electronics. Advances in such MCM technology are reviewed, including ceramic-based MCM-C, thin film MCM-D and organic laminate-based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are described. Applications of MCM to higher level integration, and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have led to performance enhancement in smart electronic devices. The book addresses the development of new materials, the characterization of methods, and the high-level integration of sensors into electronic packaging.